The School of Science and Engineering (SSE) at The Chinese University of Hong Kong, Shenzhen (CUHK-Shenzhen) sincerely invites applications for multiple faculty positions at the Professor/Associate Professor/Assistant Professor/Senior Lecturer/Lecturer levels.
The ideal candidates are expected to perform research and teaching in the following areas: Mathematics, Physics, Chemistry, Materials Science, Optics, Computer Engineering, Integrated Circuits, Information Engineering, Robotics, Network Science, Artificial Intelligence, Financial Engineering, etc. However, strong candidates in other related areas will also be considered.
Junior candidates should have (i) a Ph.D. degree (by the time of reporting for duty) in related fields; and (ii) high potential in teaching and research. Junior appointments will usually be made on a contract basis for up to three years initially, leading to longer-term appointment or tenure later subject to review.
Exceptional appointments with tenure will be considered for candidates of proven excellence. Candidates are encouraged to check out the details about the University at
Salary and Fringe Benefits
Salary will be comparable to international standards, commensurate with experience and accomplishments. Appointments will be made under the establishment of CUHK-Shenzhen. Employee benefits will be provided according to the relevant labour laws of Mainland China and CUHK-Shenzhen regulations. Subsidies from various government-sponsored talent programs will also be made available for eligible candidates:
The application package should include a cover letter, full CV, research proposals, teaching philosophy, and contact details for three independent references (The reference letters should be submitted to the online application system directly by the referees.). Candidates should specify in the cover letter the rank to which they are applying (Professor/Associate Professor/Assistant Professor/Senior Lecturer/Lecturer). Review of application will begin immediately after receiving the whole package of the application materials including the reference letters. The process will continue periodically until all positions are filled.
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